Sikadur®-31 CF

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Sikadur®-31 CF

Sikadur-31 CF

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Description

Sikadur-31 CF

2-component thixotropic epoxy adhesive.

Sikadur®-31 CF Normal is a moisture tolerant, thixotropic, structural 2-component adhesive and repair mortar, based on a combination of epoxy resins and special fillers, designed for use at temperatures between +10 °C and +30 °C.

Features:

  • Easy to mix and apply.
  • Very good adhesion to most construction materials.
  • High strength adhesive.
  • Thixotropic: non-sag in vertical and overhead applications.
  • Hardens without shrinkage.
  • Different coloured components (for mixing control).
  • No primer needed.
  • High initial and ultimate mechanical strength.
  • Good abrasion resistance.
  • Impermeable to liquids and water vapour.
  • Good chemical resistance.
  • Component colour:
    • A: white
    • B: dark grey
    • A+B mixed : concrete grey
  • Packaging:
    • 6 kg (Part A + Part B)
    • 1.2 kg (Part A + Part B), 6 set per tray

 

Usage:

  • As a structural adhesive and mortar for:
    • Concrete elements
    • Hard natural stone
    • Ceramics, fiber cement
    • Mortar, Bricks, Masonry
    • Steel, Iron, Aluminium
    • Wood
    • Polyester, Epoxy
    • Glass
  • As a repair mortar and adhesive:
    • Corners and edges
    • Holes and void filling
    • Vertical and overhead use
  • Joint filling and crack sealing:
    • Joint and crack arris / edge repair

 

Approvals / Standards

  • Adhesive for structural bonding tested according to EN 1504-4, provided with the CE-mark.

 

Mixing Ratio

  • Component A : component B = 2 : 1 by weight or volume

 

Layer Thickness

  • 30 mm max.When using multiple units, one after the other.
  • Do not mix the following unit until the previous one has been used in order to avoid a reduction in handling time.

 

Sag Flow

  • On vertical surfaces it is non-sag up to 15 mm thickness. (EN 1799)

 

Product Temperature

  • Sikadur®-31 CF Normal must be applied at temperatures between +10 °C and +30 °C

Ambient Air Temperature

  • +10 °C min. / +30 °C max.

 

Dew Point

  • Beware of condensation.
  • Substrate temperature during application, must be at least 3 °C above dew point.

 

Substrate Temperature

  • +10 °C min. / +30 °C max.

 

Substrate Moisture Content

  • Substrate must be dry or mat damp (no standing water). Brush the adhesive well into the substrate.